| 摘要 |
PURPOSE:To enable thickening of a lead frame keep plate by arranging a ball shaping device for forming a ball at the front end of the wire at an upper position of the primary position of a capillary. CONSTITUTION:When performing wire bonding by a wire bonding device, the wire 3 is connected to a pellet 14 through a ball 13 arranged at the front end of the tool arm 8. Subsequently, a capillary 9 rises and then lowers again to connect the wire 3 to the lead frame. When the wire 3 is connected to the frame 15, the frame 15 is pressed by a lead frame keep plate 16 having an enough thickness. Under this condition, the capillary 9 rises so that the frame 15 is prevented from lifting. At this time, the capillary 9 rises up to the position higher than the primary position where a torch 12 is arranged. Then the wire 3 and the torch 12 are energized by the signal from a drive circuit 37 to generate sparks and the ball 13 is formed on the wire 3 thereby completing a bonding cycle. |
