| 摘要 |
PURPOSE:To contrive improvement of the mounting density by arranging the lead part of the lead frame on either of the top surface or the bottom surface of the resin sealed body. CONSTITUTION:The leads 2b are arranged so as to surround a dhip bonding part 2a located in the center of the lead frame and one of the leads is formed to be connected to said bonding part 2a. In the center of each lead 2b, a terminal 2c projects vertically to the plane of the frame. After resin sealing 3, the terminal is exposed out of the resin surface and cut by the line CL thereby completing the operation. The exposed part of the lead is subjected to Au gilding or two- layer gilding of Ni and Au and the lead frame and the IC chip are connected by wire interconnection or gang interconnection. This constitution offers the IC suitable for incorporation of IC card especially. By using the projecting shape of the lead 2b, reinforcement of prevention of detachment and the device having high mounting density can be obtained. |
