| 摘要 |
PURPOSE:To obtain a selective pattern with few processes and high accuracy by a method in which a resist compound having stickness is applied on the substrate by making the stickness of the resist compound to be vanished by selectively exposing it through a mask pattern and making it to selectively stick to an unexposed region while dusting powder. CONSTITUTION:A resist compound having stickness is applied on a face plate 1 to be the substrate while forming a resist film 2. Next, the positions, in which respective luminant phosphors are to be formed, are selectively exposed through a shadow mask 3. The stickness of the exposed part is remarkably lowered due to hardening through luminous irradiation. The dusting of powder of the photoabsorbing material is performed on the resist film 2 having finished exposure while being applied with the photoabsorbing material. Any method of dusting such as contact through air spray and vibration can be used. Next, for instance, the photoabsorbing material does not stick to the exposed part 9, in which stickness is vanished through a developing operation by the high pressure air spray, while the photoabsorbing material remains only in the unexposed part 10 thus forming the selective pattern of a photoabsorber. |
