| 摘要 |
PURPOSE:To improve the heat insulating power of the resulting titled film by forming a plated layer of a metal having lower heat conductivity than the constituent metal of a part required to insulate heat on the part while depositing an inorg. material having lower heat conductivity than the plated layer in the plated layer. CONSTITUTION:A plated layer of a metal having lower heat conductivity than the constituent metal of a part required to insulate heat is formed on the part while depositing an inorg. material having lower heat conductivity than the plated layer in the plated layer. For example, Si3N4 is deposited in a plated Ni layer to be formed on an Al alloy. The resulting dispersion-plated Ni-Si3N4 film has much lower heat conductivity than the Al alloy, so it shows significant heat insulating power.
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