发明名称 ION PLATING DEVICE
摘要 PURPOSE:To prevent dielectric breakdown of a film deposited by evaporation by irradiating an electron ray to the surface of a base plate in the stage of depositing a metal or ceramic by evaporation on the base plate by an ion plating device. CONSTITUTION:Al 3 is evaporated by an evaporating source 2 and oxygen is introduced into a vacuum chamber 1 through a pipe 6 in the case of depositing, for example, Al2O3 on a base plate 4 by evaporation in the chamber 1. The Al is ionized by an ionizing electrode 5 and is deposited on a base plate 4 biased negative. The film is coated on the plate 4 while thermoelectron is irradiated thereto from a filament 11. The electric charge electrified positive on the surface of the film is thus made neutral and the dielectric breakdown of the film is prevented.
申请公布号 JPS59226176(A) 申请公布日期 1984.12.19
申请号 JP19830099205 申请日期 1983.06.02
申请人 SUMITOMO DENKI KOGYO KK 发明人 SHIMIZU YASUHIRO;DOI AKIRA
分类号 C23C14/22;C23C14/32;(IPC1-7):C23C13/08 主分类号 C23C14/22
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