发明名称 ELECTROFORMING METHOD
摘要 PURPOSE:To form an electroforming surface with high accuracy by coating a protective film having corrosion resistance to an electroplating soln. on a core material and subjecting the core material to electroplating then dissolving the core material. CONSTITUTION:The surface 1a of a core material 1 formed of an Al alloy which permits precision machining is optically polished and a protective film 2 of Pt, etc. having corrosion resistance to an electroplating soln. is coated on said surface 1a by vacuum deposition or the like. The material 1 on which the film 2 is coated is dipped in the electroplating soln. to form a plating layer 3 around the material 1. The circumference of the layer 3 is formed to a prescribed shape by machining and the material is further diagonally sliced to a thin sheet shape. The sheet is dipped in a dissolving soln. of NaOH, etc. to elute the material 1. An electroforming surface 2a having the surface condition equal to the surface condition of the surface 1 is thus obtd. The film 2 which has the property to be eluted together with the material 1 by the electrolyte is usable as well.
申请公布号 JPS59226188(A) 申请公布日期 1984.12.19
申请号 JP19830098600 申请日期 1983.06.02
申请人 TOSHIBA KIKAI KK 发明人 NAKASUJI MAMORU;ASANUMA NOBUTOSHI
分类号 C25D1/02;C25D1/00;(IPC1-7):C25D1/00 主分类号 C25D1/02
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