DIE BONDER FOR PREVENTING HEAT DISTORTION OF WAFER SHEET

摘要

PURPOSE: A die bonder used for a semiconductor package is provided to prevent a heat distortion of a wafer sheet by using an air blower. CONSTITUTION: A die bonder comprises a wafer stage(102) having a wafer sheet(100) for loading a wafer sawn according to a scribe line, and a heater block(112) spaced apart from the wafer stage(102). The wafer stage(102) further includes an air blower(120). The air blower(120) is to be prevented of heating of the wafer sheet(100) by blowing a nitrogen gas to the wafer sheet(100), thereby preventing a heat distortion of the wafer sheet(100).