| 摘要 |
PURPOSE:To reduce electrostatic destruction of a semiconductor element by a method wherein lead pins of different lengths of two kinds or more are provided, and input/output terminals apt to receive electrostatic destruction are connected to the lead pins of the shorter side thereof. CONSTITUTION:Long lead pins 33 and short lead pins 34 are provided to a package to load a semiconductor element, etc., and input/output lead pins to receive electrostatic destruction are provided by brazing on the back of a ceramic package base as to enable to be connected to the pins shorter by the degree of 0.5-1.0mm. as compared with the other pins. The construction of the main body of a package as well as the pins 33 of the longer side are constructed favorably as usual the same completely. |
