| 摘要 |
PROBLEM TO BE SOLVED: To prevent wire short accidents at performing wire bonding for leads, in a semiconductor device which has leads arranged in two stages. SOLUTION: An electrode pad 31a and leads 32 on the first stage, which are arranged exposed on the surface of a semiconductor chip 31, are connected with each other by the wire bonding of gold wires 34. The electrode pad 31a and the leads 33 on the second stage are connected with each other with the wire bonding of gold wires 35. The diameter of the gold wire 35 is larger than the diameter of the gold wire 34, which brings a difference into existence in flexibility. Therefore, the gold wire 35 is connected, passing a position higher than, that of the gold wire 34, so that the occurrence of wire shorts are prevented. |
