| 摘要 |
PURPOSE:To reduce the obstruction of the operation of an attached semiconductor element even though a high frequency signal is inputted and outputted, by providing a lead pin for obtaining a substrate potential so as to face a lead pin, which is contacted with a peripheral circuit. CONSTITUTION:A package for semiconductor element is electrically connected to dielectric waveguide path. A substrate-potential lead pin 16 is arranged so as to face a lead pin 3. The electrical connection to the dielectric waveguide path is provided by both pins. A signal from the lead pin 3 is inputted or outputted with respect to the semiconductor element, which is attached to a dicing pad 5 by providing a thin metal wire between the element and a bonding pad. Meanwhile, the substrate potential of the semiconductor element is taken out by a lead pin 14 facing said lead pin through a conductive layer, which is attached on the pad 5. Therefore, the substrate potential of the semiconductor element can be made to be the grounding potential of the dielectric waveguide path. |
