| 摘要 |
PURPOSE:To obtain a semiconductor light emitting device characterized by a compact size, less deterioration in current conduction, and excellent linearity of emitting output, by machining both tips of two terminals of an anode and cathode in a dish shape. CONSTITUTION:After blanking by a die, upper parts are struck by a punch for forming a reflecting surface, and the reflecting surfaces are formed on the end surfaces of two terminals at one time. As a result, the restriction on the size of a pellet is greatly alleviated, and the pellet for a large light emitting diode can be intactly used. The light emitting diode, which is characterized by a compact shape and high efficiency in light emittance and has the same characteristics as those of the large light emitting diode with respect to deterioration in current conduction and linearily in light emitting power vs. conducting current, can be obtained. |
