发明名称 METHOD AND DEVICE FOR POSITIONING AND HOLDING ELECTRONIC PART
摘要 Method and apparatus for holding an electronic component prior to its placement on a circuit substrate. The component sucked by a sucker is first centered in one direction by closing movements of a first pair of opposed positioning members toward the component, and then centered in another direction normal to the above one direction by closing movements of a second pair of opposed positioning members which occur only after the first pair of positioning members are opened. The first pair of positioning members are provided on an assembly holding the sucker, and the second pair of positioning members are provided on the sucker holder assembly or separately from the sucker holder assembly. In the latter instance, the assembly holding the sucker and the first pair of positioning members are adapted to be movable relative to the separately provided second pair for alignment of the sucker with the separate second pair.
申请公布号 JPS59224279(A) 申请公布日期 1984.12.17
申请号 JP19830097363 申请日期 1983.06.01
申请人 FUJI KIKAI SEIZOU KK 发明人 ASAI KOUICHI;TSUDA MAMORU;OOE KUNIO;MUTOU YASUO
分类号 B23P19/00;B23P21/00;B25J15/00;H05K13/04;(IPC1-7):B25J15/00;H05K1/18 主分类号 B23P19/00
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