| 摘要 |
PURPOSE:To solder a semiconductor pellet to the flat surface of an electrode, by using the electrode, which comprises a core material whose main component is copper and a tube material whose main component is an alloy of iron, nickel, and cobalt that is bonded to said core material metallurgically, thereby eliminating humidity resisting problem with respect to leads. CONSTITUTION:An electrode 6 comprises a core material 6a of copper including slight amount of zirconium and a tube material comprising 30wt% nickel, 14.5wt% cobalt, 0.45wt% manganese, and iron as a remainder material, which are metallurgically sintered. Since machining can be readily performed, an end surface, to which a silicon pellet is soldered, can be readily made flat. In order to prevent the diffusion of the copper component of the core material into the silicon pellet 1 by the heating at the time of soldering or burning of glass, or in order to prevent the deterioration of characteristics of the silicon pellet 1 caused by the formation of the alloy, it s recommended that a shielding film made of nickel or titanium is provided on the main surface of the silicon pellt, which is not shown in the Figure. |
