| 摘要 |
PURPOSE:To increase the mechanical strength of a lead wire and to reduce the inductance of the lead wire, by bending the lead wire in the inside of a resin at a right angle with a plane formed by a metal plate, and extracting the lead wire to the outside from the bottom surface of the resin. CONSTITUTION:Each lead wire 13 is bent in the direction of the bottom surface of a resin 15 at the opposite side with respect to the side, where a semiconductor pellet 11 of a metal plate 12 is bonded, at a part 17 in the inside of the resin 15. The lead wire is extracted to the outside from the bottom surface of the resin 15. The lead wire is not required to be bent and shaped at the outside where an external force is applied. Therefore, even though the lead wire is made thin, no problem occurs in the mechanical strength of the wire. Furthermore, the inductance of the lead wire 13 can be reduced. |
