发明名称 BONDING OF PANEL BY MAGNETIC INDUCTION HEATING
摘要 PURPOSE:To perform bonding of a panel without causing depression and distortion on the surface, by charging a magnetic coil with high frequency current and heating the hemmed area to cure a thermosetting adhesive with generated magnetic energy. CONSTITUTION:A pair of magnet generating coils 10, 11 connected to a high- frequency power source 9 are provided near a hemmed area 2 so that the hemmed area may be lightly supported between the coils and high-frequency current is applied to the coils 10, 11 by the power source 9. Thus the area adjatant to the coils 10, 11 are heated by electromagnetic induction heating and a thermosetting adhesive 8 is thermally cured in parts. Curing of the adhesive in two or more points causes temporary bonding of an outer panel 1 and an inner panel 7. When the panels 1 and 7 are coated and baked in a baking oven, all the uncured areas of the adhesive 8 are heat-set to complete the bonding process of the outer panel 1 and the inner panel 7.
申请公布号 JPS59223777(A) 申请公布日期 1984.12.15
申请号 JP19830097969 申请日期 1983.06.03
申请人 NITSUSAN SHIYATAI KK 发明人 HARUHARA AKIRA;SAIJIYOU ETSUROU
分类号 C09J5/00;B29C65/00;B29C65/02;B29C65/48;B29C65/78;B60J5/00;B62D65/00;C09J5/06 主分类号 C09J5/00
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