| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer pin, a collet and a die bonder capable of efficiently transferring an adhesive, and transporting a semiconductor device bonding a chip by flip-chip bonding without reducing the yield. SOLUTION: Since the tip part of the transfer pin 9 has two projected parts having a length longer than the depth to which an adhesive 2 in a storage saucer 3 is subsided from the surface, the pin can transfer the adhesive 2 to two points by one time transferring operation. The suction hole of the collet 10 has a diameter larger than a semiconductor chip, the collect 10 can lower the load to be applied to the bump which connects the semiconductor chip to a sub-mount substrate at the time of picking up or stopping the movement after adsorption.
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