| 摘要 |
PURPOSE:To contrive the improvement of durability of a die bonding by bonding and fixing a semiconductor chip with selecting the most suitable values of the factors of curing condition by using the conductive paste consisting of a heat- resistance resin binder mixed with conductive particles. CONSTITUTION:The semiconductor chip 2 is die-bonded virtually in the center of a large area region of a lead frame 1 while interposing the conductive paste 3. For the paste 3, the heat-resistance resin in which Ag particles are dispersed is most suitable. Quantity of the paste 3 to be dripped onto the frame 1 is preferably as least as possible within a range where the chip 2 is bonded with the frame 1 almost perfectly. Next, a layer of the Ag paste driped is stretched thinly and the chip 2 is placed by pressing with vibration. Next, preliminary curing with low temperature for slow curing speed is performed prior to heating. After the preliminary curing, curing with higher temperature is performed in a short time. By this method, the overall improvement with regard to the durability of a die bonding can be contrived. |
