SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A semiconductor chip package is provided to prevent a defect like a solder ball junction defect or solder joint crack generated when a conventional solder ball is used as an external connection terminal, by using a ball pad as the external connection terminal. CONSTITUTION: A predetermined integrated circuit is formed in a semiconductor chip(10) having an electrode pad(11) for connecting the integrated circuit to the outside. A circuit interconnection(23) is formed in a polyimide tape(21). A tape(20) for tape automated bonding(TAB) has a beam lead(25) coupled to the electrode pad, electrically connected to the circuit interconnection. Elastomer(27) fixes the semiconductor chip and the tape, interposed between the semiconductor chip and the tape. The ball pad(28) protrudes from the polyimide tape by a predetermined height, coupled to the circuit interconnection to be electrically connected to the semiconductor chip.