THICK FILM CONDUCTOR EMPLOYING COPPER OXIDE

摘要

Printed circuits are made by depositing a conductor paste on an insulating substrate and heating the paste to render it conductive and adherent to the substrate. This invention provides improved pastes, comprising 7 to 27 wt.% boron. Optionally up to 35 wt.% glass frit, and copper oxide. The pastes may also contain metallic copper. They can satisfactorily be fired at 500 to 675 DEG C in air.