发明名称 ADHESIVE COMPOSITION
摘要 PURPOSE:To provide a composition for the bonding of rubber in water, etc., having excellent adhesivity and flexibility, and obtained by adding specific amounts of a hardly water-soluble amine and amide to an epoxy resin containing >=50wt% of an epoxy resin prepared by the reaction of a specific long-chain dibasic acid with an epoxy resin. CONSTITUTION:The objective composition is composed of (A) 100pts.wt. of epoxy resin composition containing >=50wt% of an epoxy resin obtained by reacting a long-chain dibasic acid of formula (R is alkyl or alkenyl wherein the C number of the straight chain is 2-8) with an epoxy resin having two or more epoxy groups in the molecule and (B) 4-430pts.wt. of a hardly water-soluble amine and/or amide (e.g. m-phenylenediamine, a polyamide derived from the dimer of linoleic acid and ethylenediamine, etc.). USE:It exhibits especially excellent adhesivity to chloroprene rubber.
申请公布号 JPS59221367(A) 申请公布日期 1984.12.12
申请号 JP19830094932 申请日期 1983.05.31
申请人 YOKOHAMA GOMU KK 发明人 YAMAGUCHI KIYOHIRO;TAKAHASHI TOSHINOBU
分类号 C08G59/00;C08G59/44;C08G59/50 主分类号 C08G59/00
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