| 摘要 |
PURPOSE:To simplify the assembly process and miniaturize the mounting structure by forming the circuit part for fixing the titled component at the center and terminals into an integral body, backing only the circuit part with an insulation substrate, and bending the circuit part projecting to both sides of the substrate. CONSTITUTION:The circuit part 8 having the mounting part 13 for the fixing said components such as a semiconductor element and a chip capacitor at the center, external terminals 9, and the peripheral frame 11 cut off after mounting the component 2 are integrally punched out into a lead frame. Next, the part 2 is fixed on the mounting part 13, an Al plate 2 coated with glass epoxy resin is adhered only to the back surface of the circuit part 8, the terminals projecting out of it are bent downward at a right angle, and the unnecessitated peripheral frame 11 is cut off. Thus, the assembling process is simplified, and at the same time the mounting structure is miniaturized. |
