| 摘要 |
PURPOSE:To perform soldering without contact of a solder liquid with the other surface and without requiring the labor for adjusting the liquid level thereof, etc. by placing a material to be soldered on the imposing surface through which the solder liquid can flow out to the outside circumferential part and ejecting the solder liquid through the apertures of the imposing surface. CONSTITUTION:A soldering base 16 of which the top end is used as an imposing surface 15 for a material 14 to be soldered is projected in a soldering tank 11 and a solder liquid 18 which is heated and melted by a heater 17 is filled in the inside of the base 16 and the inside of the tank 11 on the outside circumference of said base. The inside of the base 16 and the tank 11 is connected to each other by a piping 20 via a pump 19 and the solder liquid 18 melted by a heater 22 is admitted under pressure into the base 16. The surface 15 is smoothly formed on the top end of the base 16 and ejection holes 23 through which the liquid 18 admitted under pressure to the surface 15 by the pump 19 is ejected are formed in the area smaller than the solding surface 24 of the material 14. Then the liquid 18 ejected from the holes 23 collides only against the surface 24 without projecting to the outside and forms the solder liquid layer on the surface 24 and thereafter the solder liquid flows to the outside from the outside circumferential part of the surface 15. |
