发明名称 Method of fabricating a multi-layer type semiconductor device including crystal growth by spirally directing energy beam
摘要 A method of producing a superior semiconductor crystallized layer rapidly on a semiconductor substrate with the surface thereof covered with an insulating film is disclosed. An opening, desirably formed by at least two insulating films, is formed at an intersection of scribe lines of the semiconductor substrate. A polycrystal semiconductor film is formed on the insulating films and the opening, after which an energy beam is irradiated spirally on the polycrystal semiconductor film in such a manner that the beam passes at least one opening during each rotation thereof thereby to transform the polycrystal semiconductor film into a crystallized layer for forming a semiconductor element.
申请公布号 US4487635(A) 申请公布日期 1984.12.11
申请号 US19830466301 申请日期 1983.02.14
申请人 DIRECTOR-GENERAL OF THE AGENCY OF INDUSTRIAL SCIENCE & TECHNOLOGY 发明人 KUGIMIYA, KOICHI;AKIYAMA, SHIGENOBU;FUSE, GENSHU
分类号 H01L27/00;H01L21/20;H01L21/263;H01L21/822;H01L27/06;(IPC1-7):H01L21/263;B05D3/06 主分类号 H01L27/00
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