| 摘要 |
PURPOSE:To make heat contact effective without laying any heat conductive material between integrated circuit elements and heat conductive plates by a method wherein the titled structure is composed of print substrate assembling bodies wherein multiple integrated circuit elements are insertedly connected to sockets loaded on the surface of the elements, a heat conductive plate and supporters with resilience. CONSTITUTION:The titled heat dissipating structure is composed of print substrate assembling bodies wherein multiple integrated circuit elemente 2 are insertedly connected to sockets 8 provided on the surface of a print substrate 1 corresponding to their loaded positions, a heat conductive plate 3 with excellent heat conductivity such as copper plate fixed to the print substrate 1 by fixture 5 at the position slightly higher than the surface of each integrated circuit element 2 mounted on the sockets 8 and supporters 7 formed respectively to hold the heat conductive plate 3 and each integrated circuit element 2. The supporters 7 are provided with the resilience to the direction expelling the integrated circuit elements 2 out of said sockets 8, exceeding the resilience of said sockets 8 holding said elements 2. |
