发明名称 Epoxy resin
摘要 An epoxy composition derived from tetraglycidated methylene dianiline cured with a methylated maleic acid adduct of phthalic anhydride has a high glass-transition temperature and a low curing temperature and when cured has very high bond strength. This epoxy can be used to bond a diamond cutterhead stylus to a piezoelectric element.
申请公布号 US4488283(A) 申请公布日期 1984.12.11
申请号 US19830545736 申请日期 1983.10.26
申请人 RCA CORPORATION 发明人 CHUNG, KWONG T.
分类号 G11B3/46;H04R1/18;(IPC1-7):G11B3/44 主分类号 G11B3/46
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