HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME AND ELECTRONIC DEVICE

摘要

A hybrid integrated circuit device having high mounting reliability, comprising a modular substrate of ceramic wiring board, a plurality of electronic components built in the principal surface of the modular substrate, a plurality of electrode terminals provided on the rear surface of the modular substrate, and a cap secured to the modular substrate while covering the principal surface of the modular substrate. The electrode terminals include a plurality of electrode terminals arranged along the edge of the modular substrate, and power supply potential supply terminals arranged on the inner side of the plurality of electrode terminals, wherein the electrode terminals arranged along the edge of the modular substrate are covered with a protective film at least the part close to the electrode terminals. The protective film is not thicker than ten and several mu m. A connection strength enhancing terminal comprises a plurality of split terminals independent of each other. The connection strength enhancing terminal is a ground terminal.