| 摘要 |
An all-metal microwave chip carrier is provided with subminiature ceramic feedthroughs, each configured to function as a coaxial cable having a predetermined impedance. In one embodiment, the feedthroughs are formed by providing ceramic tubing metallized inside and out in which the ends are cut away to provide half-cylindrical bonding pads. In order to permit bonding directly to the feedthrough, a flat wire lead is soldered to the channel in the ceramic tube, with the ends of the flat wire extending onto the flat portions of the half-cylindrical portions of the feedthrough. In one embodiment, the chip carrier includes a base, ring, and stepped lid, all of Kovar or other suitable material, with the lid being weldable to the ring rather than being brazed or soldered.
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