发明名称 EXTREMELY THIN SOLDER TAPE
摘要 PURPOSE:To provide an extremely thin solder tape which permits easy reduction in wall thickness in casting structure and has excellent strength, solder spreadability and punchability by consisting the tape of Pb, Sn, Cd, Bi, Zn, Al, In, Ag or Au. CONSTITUTION:A molten metal 5 of the above-described metallic solder material is charged into a crucible 4 and the molten metal 5 is ejected through a nozzle 3 onto a cooling roll 1 rotating at a high speed in an arrow direction, by which the molten metal is quickly cooled and solidified. An extremely thin solder tape 6 having 15-70mum thickness of the casting structure is thus obtd. Since the wall thickness of the tape 6 is extremely thin, the spreading of the solder coating part is small and sticking of the excess solder is obviated. The tape is excellent in terms of energy consumption as well.
申请公布号 JPS59220298(A) 申请公布日期 1984.12.11
申请号 JP19830095494 申请日期 1983.05.30
申请人 FURUKAWA DENKI KOGYO KK 发明人 SHIROYAMA KAISUKE;KIKUCHI SUKEYUKI;KOSUGI KEIZOU;FUJII KOUJI
分类号 B23K35/14;B23K35/02;B23K35/40;(IPC1-7):B23K35/02 主分类号 B23K35/14
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