| 摘要 |
PURPOSE:To reduce the manufacturing cost of a semiconducltor device and to improve the reliability of the device by covering a heat sink plate exposed from a resin-sealed unit with a coating film formed of resin. CONSTITUTION:An electrode lead 12 and a leadframe 11 having a heat sink plate 13 which is used also as an element base are formed, and a semiconductor pellet 15 is mounted via gold-silicon eutectic crystal on the plate 13. Then, the electrode of the pellet 15 and the electrode lead of the frame 11 are bonded via a bonding wire 16. Then, the frame 11 is molded with resin by using epoxy resin, and a resin-sealed unit 17 exposed on the back surface of the plate 13 is formed. A coating agent is thinly extended on the exposed surface of the plate 13, hardened and formed with a coating film 19. |
