| 摘要 |
PURPOSE:To reduce the size of an electronic device by mounting a leadless chip carrier through a socket on a printed board to eliminate a possibility of fatigue breakdown of a solder layer, readily removing the carrier to replace it, and minimizing the height on the mounted board. CONSTITUTION:A socket body 16 is formed of synthetic resin, a containing chamber 17 of box-shaped recess for movably receiving a chip substrate 1 of an opponent leadless chip carrier is formed, and pawl-shaped stoppers 5 are respectively formed on two surfaces corresponding to the recesses 12 of the board 1 on the side. The pawl 15a of the end of the stopper 15 is slightly projected from the side of the chamber 17, and when the substrate 1 is inserted, it is removed, retarded by the deflection of the elastic arm 15b of the stopper 15, the pawl 15a is returned by the elastic force, and connected to the recess 12 of the step 13 of the substrate 1 to secure the substrate 1 to the chamber 17 of the socket body 16, and the bump 8 of the substrate 1 is contacted with a connecting terminal 19 arranged on the bottom of the chamber 17. In this manner, the printed substrate can be closely arranged in contact in the housing. |
