发明名称 PLASMA SURFACE TREATMENT
摘要 PURPOSE:To prevent a fault such as malfunction of an instrument or the like placed around a plasma treating device in the plasma treatment stage of a conductive structural body by introducing the plasma from a plasma generating part provided separately from a treating chamber into the treating chamber. CONSTITUTION:A sheath 12 of a cable 10, etc. is stripped off and an exposed core part 16 is put into a plasma treating chamber 24 then the chamber is hermetically closed. Gas such as O2, He, Ar or the like is conducted from a gas bomb 30 into the chamber and the inside of the chamber is evacuated to a vacuum by a vacuum pump 28. When the vacuum degree in the chamber 24 stabilizes, a high frequency is impressed thereto from a high frequency generator 38, etc. to generate plasma in a plasma generating part 40 sandwiched by electrodes 34 and 36. The plasma is introduced into the chamber 24 and the sheath 12 and the exposed core part 16 are subjected to the plasma surface treatment. As a result the high frequency magnetic field is no more applied on the conductive material and therefore the leakage of the high frequency is prevented and the noise to the measuring instrument or the like placed around the plasma treating device is prevented.
申请公布号 JPS59219470(A) 申请公布日期 1984.12.10
申请号 JP19830091979 申请日期 1983.05.25
申请人 FURUKAWA DENKI KOGYO KK 发明人 SHIMIZU MASAAKI;SHIMANO TAKASHI
分类号 C23F4/00;H01J37/32;(IPC1-7):C23F1/00 主分类号 C23F4/00
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