发明名称 |
Composite sacrificial material |
摘要 |
A composite sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The composite sacrificial material includes a polymeric or oligomeric matrix with filler material mixed therein. The filler material may be particulate matter that may be used to modify one or more properties of the composite sacrificial material during semiconductor processing.
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申请公布号 |
US6858528(B2) |
申请公布日期 |
2005.02.22 |
申请号 |
US20030393063 |
申请日期 |
2003.03.20 |
申请人 |
INTEL CORPORATION |
发明人 |
MEAGLEY ROBERT P.;GOODNER MICHAEL D. |
分类号 |
H01L21/31;H01L21/311;H01L21/469;H01L21/4763;H01L21/768;H01L23/48;H01L29/02;H01L47/00;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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