| 摘要 |
PURPOSE:To effectively utilize a wafer with a reticle to be used in the stage of repeatedly forming patterns by dividedly forming the 1st and 2nd patterns so as to continuously form the 1st and 2nd patterns onto the reticle. CONSTITUTION:A thin film magnetic head, etc. is formed by patterning the reticle 21 by a step and repeat system. The reticle 21 is continuously conveyed to the wafer and chips 25, 26 are formed. A pattern 22 for the head and the 1st pattern 23, the 2nd pattern 24 for dummies are formed on the respective chips. The patterns are so formed that the 1st pattern 23 of the chip 25 connect to the 2nd pattern 24 of the chip 26 to form the U-shaped dummy pattern. The dummy patterns are formed along the boundary lines 27 of the chips which correspond to the cutting allowances for dividing the wafer in the above- mentioned manner. Since the reticle having the dummy patterns along the boundary lines of the chips is formed, the wafer is effectively utilized. |
