| 摘要 |
<p>PURPOSE:To enhance the packing density of a computer main body by providing a cooling passage on a substrate which consists of materials having high thermal conductivity, and has IC chips fixed and flowing forcibly a very low-temperature fluid to this passage. CONSTITUTION:A computer body 3 is stored in a vacuum vessel 1. The body 3 is constituted by combining IC chips P incorporating Josephson junction elements. Chips are fixed to the surface of a substrate 10, and the substrate 10 is fixed to a board 11. A cooling fluid passage 12 is provided in each substrate 10 and the board 11, and one ends of pipes 13 and 14 and one ends of pipes 16 and 17 are connected to the entrance and the exit of the system of the passage 12 respectively, and the other ends of pipes 13, 14, 16, and 17 are connected to a liquid He supply device 15 through the wall of the vessel 1. In this case, the diameter of the passage 12 in the substrate 10 may be sufficiently small, and it is unnecessary to increase the thickness of the substrate 10 because of existence of the passage 12. No hindrance is placed even if intervals of substrates 10 are narrowed to such degree that chips P are not brought into contact with one another.</p> |
