发明名称 |
PACKAGE FOR PHOTODIODE OR LIGHT EMITTING DIODE |
摘要 |
<p>An electro-optical element package comprises a transparent substrate (52) on which an electrode pad (51) containing an opening (53) is formed and the electro-optical element (59), such as a light emitting diode or photodiode, is bonded on top of the electrode pad (51) over the opening so that light is transmitted to or from the element (59) through the transparent substrate (52) and the opening. A peripheral ceramic member (54) is bonded to the substrate (52) around the element (59) and a further peripheral ceramic member (58) is bonded to the member (54) to support a cap for sealing the package. The electrode (51) and a further electrode connected to the element (59) by a bonded wire (60) extend out of the package between the ceramic members (54) and (58).</p> |
申请公布号 |
AU2808584(A) |
申请公布日期 |
1984.12.06 |
申请号 |
AU19840028085 |
申请日期 |
1984.05.16 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES LTD. |
发明人 |
HIDEAKI NISHIZAWA |
分类号 |
G02B6/42;H01L23/02;H01L31/02;H01L31/0203;H01L33/62 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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