发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDING CONSISTING OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition having a high sound-insulation improving effect and excellent in mechanical characteristics, particularly in the balance between strength, rigidity and impact property, and to provide a molding consisting thereof. SOLUTION: The polyamide resin composition is incorporated with 15-80 wt% of a polyamide (A), 10-35 wt% of a glass fiber (B), 5-30 wt% of barium sulfate (C) and 5-25 wt% of an impact resistance improver (D), and the average particle size of the barium sulfate (C) is 0.05-10μm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232239(A) 申请公布日期 2005.09.02
申请号 JP20040040698 申请日期 2004.02.18
申请人 TORAY IND INC 发明人 KAMISHIRO TAKESHI;WAKATAKE SHOICHI
分类号 C08L77/00;C08K3/30;C08K7/14;C08L23/26;(IPC1-7):C08L77/00 主分类号 C08L77/00
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