| 摘要 |
<p>Wafers (36) are rotated by a grooved driver (16) engaging the wafer circular (36a) to position flats (36b) on the wafers (36) in the same orientation. The driver (16) is then automatically moved closer to the wafers (36) to engage the flat edges (36b) and then rotate the wafers (36) a selected amount to obtain the desired orientation. </p> |
