发明名称 Focusing magnetron sputtering apparatus.
摘要 <p>A cathode assembly (10) for use in a magnetron sputtering system, the system having a cathode assembly with parallel elongated target segments (74,75) which are formed substantially of a material which is desired to be sputter- deposited onto a substrate. The elongated target segments are each provided with a material removal surface which is inclined toward the other segment with respecttothe plane of the substrate. Such inclination permits the material which is removed from the target bars to be focussed onto a relatively narrow area, thereby improving the efficiency of the sputtering operation and reducing machine down-time for cleaning and vacuum pumping. End target segments (66, 67) are provided for improving the efficiency of film deposition near the ends of the elongated bars. The end target segments are provided with material removal surfaces which are also inclined. and connect with the elongated target segments to form a rectangular frame arrangement. An elongated inner pole piece (71) has outwardly extending portions (99) near each end to improve uniformity of a trapping magnetic field between the inner pole piece and a rectangular annular outer pole piece.</p>
申请公布号 EP0127272(A2) 申请公布日期 1984.12.05
申请号 EP19840301651 申请日期 1984.03.12
申请人 MATERIALS RESEARCH CORPORATION 发明人 CLASS, WALTER H.;HIERONYMI, ROBERT G.;HURWITT, STEVEN D.
分类号 C23C14/36;C23C14/35;H01J37/34;(IPC1-7):01J37/34 主分类号 C23C14/36
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