发明名称 PLATING METHOD OF FIBER BUNDLE
摘要 PURPOSE:To perform uniform plating by holding a fiber bundle in an open state while forming successively or simultaneously slacks in the tensionless state to the fiber bundle in plural plating cells. CONSTITUTION:A fiber bundle 1 is introduced into the 1st plating cell 2 and the 2nd plating cell 3, by which the bundle is plated. The 2nd cylinder 14 of the stopper 9 at the end of the cell 3 is turned on after starting and a holder 15 connecting to said cylinder is moved downward to press the plated bundle 1 onto a receiving base 16. A delivery device 8 is then turned on and the rolls thereof revolve toward the arrow, thereby forming a tension-less slack on the bundle 1. The device 8 is turned off and at the same time the 1st cylinder 13 of the cell 2 is moved downward to press the bundle 1, thereby forming the slack similar to the slack made in the cell 3. The cylinders 13, 14 are turned off and a take-up reel 7 takes up the bundle 1. The above-mentioned operation is repeated.
申请公布号 JPS59215498(A) 申请公布日期 1984.12.05
申请号 JP19830089868 申请日期 1983.05.20
申请人 HITACHI DENSEN KK 发明人 YOSHIDA HIROMICHI;KAYANE KOUICHI;SUZUMURA TAKASHI;SASAKI SATOSHI;YAMAGISHI RIYOUZOU;YOSHIOKA OSAMU;ISHIKAWA TETSUO;SATO HIDEAKI
分类号 C25D7/00;B65H51/005;C23C18/16;C23C18/31;C25D7/06;D06M11/00;D06M11/83;D06M11/84;D06M101/00;D06M101/40;(IPC1-7):C25D7/06;C23C3/02 主分类号 C25D7/00
代理机构 代理人
主权项
地址