发明名称 PLATING METHOD OF FIBER BUNDLE
摘要 PURPOSE:To subject uniformly a fiber bundle to plating by providing flow regulating walls at the top and bottom in a parallel flow passage for a plating soln. in addition to the flow regulating walls provided on both sides of the fiber bundle and delineating the parallel flow. CONSTITUTION:A fiber bundle 1 is immersed in the plating soln. 2 in a plating cell 3 and is transferred to an arrow direction. A pair of nozzles 4 on the feed side thereof generate the plating soln. flow in parallel with the transfer direction of the bundle 1, thereby forming a parallel flow passage. The bundle 1 is held open and is plated in this state. Flow regulating walls 5 on both sides of the bundle 1 positioned to face each other in parallel via the fiber bundle interposed in the central position between both walls and flow regulating walls 7 above and below the bundle 1 are provided over the adequate region from the position near said nozzle 4. The bundle 1 is thus held stably open and is uniformly plated.
申请公布号 JPS59215497(A) 申请公布日期 1984.12.05
申请号 JP19830088230 申请日期 1983.05.19
申请人 HITACHI DENSEN KK 发明人 YOSHIDA HIROMICHI;KAYANE KOUICHI;SUZUMURA TAKASHI;YAMAGISHI RIYOUZOU;YOSHIOKA OSAMU;ISHIKAWA TETSUO;SATO HIDEAKI
分类号 C25D7/00;C25D7/06;D06M11/00;D06M11/83;D06M11/84;D06M101/00;D06M101/16;D06M101/30;D06M101/34;D06M101/40;(IPC1-7):C25D7/06 主分类号 C25D7/00
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