| 摘要 |
PURPOSE:To improve production efficiency by pasting the small piece of a polyimide film of a predetermined shape, on one surface thereof an Si adhesive layer is formed, on a long-sized mold releasing tape. CONSTITUTION:The small pieces P of polyimide films 10 with Si adhesive layers 20 are pasted continuously on a mold releasing tape 60. The small piece P of such a predetermined shape is manufactured in such a manner that Si adhesives are applied on a long-sized mold releasing film and dried half, an original foundation prepared by thermocompression-laminating the polyimide film on the adhesive layer is treated by a sealing printer, and half-cut to a prescribed shape up to the Si adhesive layer from the surface of the polyimide film and a protective film for a semiconductor circuit is manufactured. According to the protective film, a protective coating pasting process can be shortened because a punching process for a coating in the pasting process is unnecessitated. |
