发明名称 RESIN COMPOSITION
摘要 PURPOSE:A thermosetting resin composition improved in fluidity during molding, comprising a thermosetting resin and amorphous quartz spheres having thermally sprayed fine quartz particles on the surface. CONSTITUTION:A resin composition comprising 100pts.wt. thermosetting resin and 60-400pts.wt. amorphous quartz particles of which the surfaces contain fine quartz particles formed by thermally spraying a silicon-containing substance having a maximum particle diameter <=500mu and an SiO2 purity >=97wt% into an oxyhydrogen flame. Examples of the thermosetting resins include silicone, epoxy, phenolic, polyester, polyimide, polyurethane, and diallyl phthalate resins. When the mixing proportion of the filler is below 60pts.wt., the electrical insulation is poor, while when it exceeds 400pts.wt. the spiral flow length decreases, which are not desirable.
申请公布号 JPS59215337(A) 申请公布日期 1984.12.05
申请号 JP19830088709 申请日期 1983.05.20
申请人 DENKI KAGAKU KOGYO KK 发明人 IDE RIYOUICHI;OOTAGURO KENJI;KOBAYASHI AKIRA
分类号 C08K3/00;C08K3/34;C08K3/36;C08K9/00;C08L67/00;(IPC1-7):C08K9/00 主分类号 C08K3/00
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