发明名称 LINEARLY ADVANCING POLISHING METHOD AND APPARATUS
摘要 In a rotating type polishing process method, it is difficult to continuously send works to an apparatus and to effectively use a space in the periphery of the apparatus. A linearly advancing polishing process method and an apparatus having a novel concept for solving such problems are provided. Each of a pair of parallel flat plane surface plates adjacent to each other in parallel makes a linear movement in a direction opposite to each other. A work is pressed to both of the surface plates to apply a couple to the work for a rotary movement. The work is polished by abrasive grains by a relative movement of the rotation of the work and the pair of surface plates making the linear movements. The pair of parallel flat plane surface plates are opposed to another pair of parallel flat plane surface plates. Then the work can be sandwiched between the pairs and one plane or both planes can be polished. Instead of using the flat plane surface plates, a belt-type polisher that passes through on a work supporting table may be used.
申请公布号 KR20060132954(A) 申请公布日期 2006.12.22
申请号 KR20067019958 申请日期 2006.09.27
申请人 JAPAN SCIENCE AND TECHNOLOGY AGENCY 发明人 YASUI HEIJI
分类号 B24B37/04;B24B21/00;B24B21/04;B24B37/07 主分类号 B24B37/04
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