| 摘要 |
PURPOSE:To rationally treat terminals of a head, by a method wherein a plurality of semiconductor elements are connected integrally to electrodes provided on main surfaces, and ends on one side of the electrodes are pressed against electrode taking-out parts provided on two main surfaces of an insulated substrate. CONSTITUTION:A row of heating elements 8 and the semiconductor elements 9 are electrically connected, and simultaneously the lead taking-out parts 10 for the substrate are provided on both of the main surfaces 7a, 7b. When the takingout parts 10 are provided at positions away from and in parallel to the row of the heating elements 8 on the main surfaces 7a, 7b, subsequent assemblage of the head is facilitated. The substrate 6 for the heating elements 8 is tentatively fixed to a head base 11, and simultaneously a flexible film lead 12 is also tentatively fixed. Then, a head cover 14 is fixed to the base 11 by screws 15, whereby pressed parts are entirely electrically connected, and an end face type therml head 16 is completed. |
