| 摘要 |
A WBL(Wafer Backside Lamination) tape and a semiconductor package using the same are provided to improve reliability by exhausting voids from the WBL tape using grooves. A WBL tape(10) is used for attaching a die onto a substrate. A plurality of grooves(11) are formed on the WBL tape in order to remove voids from the WBL tape. The plurality of grooves are spaced apart from each other. The groove is formed like one selected from a group consisting of a line type structure or a cross type structure. The WBL tape is interposed between the die and the substrate, so that the die is stably attached to the substrate without voids.
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