| 摘要 |
PURPOSE:To increase the mounting density enabling memories to be additionally mounted by a method wherein a framework is fixed on a thin insulated substrate with a semiconductor element for memory fixed thereto while a solder layer is formed on the periphery of the framework as a terminal for external connection. CONSTITUTION:Multiple recessed notches 2 are provided on the side of a thin insulated substrate 1 while patterned conductors 3 are formed on the substrate 1 respectively to be extruded and extended to the notches 2. Moreover, a semiconductor element 4 for memory is fixed on the substrate 1 and the electrode of the element 4 is bonded to the conductors 3 for connection. On the other hand, a framework 5 formed of heat resistant material is provided with multiple recessed grooves 6 on the periphery of the framework 5 aligned with the notches 2 on the substrate 1 while each groove 6 is provided with a metal layer 7 and a solder layer 8. Such parts 6' of the framework 5 are heated to be bonded to the substrate 1. In case of this bonding process, the notches 2 and the grooves 6 are aligned with one another and the layer 8 in the grooves 6 is melted to solder with the conductors 3. Through these procedures, the substrate 1 may be reinforced by the framework 5 while the layer 8 becomes a terminal for external connection. |
