发明名称 SETUP OF SUBSTRATE AND CONNECTION OF BONDING WIRE
摘要 PURPOSE:To enable to attain precise attachment of equipping parts by a method wherein identification symbols are adhered on a substrate in the neighborhoods of the positions to be crowded with the equipping parts or conductor patterns, or the attaching positions of comparatively large equipping parts. CONSTITUTION:An identification symbol 7 is adhered on a substrate 1 by every equipping parts in the neighborhood of the position to be attached with the equipping parts 3 such as an IC chip, a resistor, a capacitor, etc. By reading the symbol thereof according to a symbol read device using a TV camera, etc., the substrate 1 is set up at the prescribed space position, and the parts 3 is attached on the substrate 1. Moreover, an identification symbol 7 is adhered to the neighborhood of leads 5 on the substrate 1 by every group of the leads 5 to respective IC chip 4. By adhering such the symbols 7, erroneous identification is not generated even when pattern identification of the leads 5 is to be performed, precise pattern identification can be attained, and erroneous bonding can be checked.
申请公布号 JPS59215736(A) 申请公布日期 1984.12.05
申请号 JP19830091295 申请日期 1983.05.24
申请人 TOSHIBA KK 发明人 CHIBA KOUICHI;TERASAKA YOSHIO
分类号 H05K13/04;H01L21/60;H01L21/68;H05K1/02;H05K3/30 主分类号 H05K13/04
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