| 摘要 |
<p>PURPOSE:To prevent crack and exfoliation of semiconductor element without deteriorating heat radiation characteristic by constituting a support with a metal material having a high thermal conductivity and a metal body having a low thermal expansion coefficient. CONSTITUTION:A semiconductor element 204 is fixed to a metal support 205 and a metal support 205 is fixed to a heat radiating base 201. A metal support 205 is composed of a first metal material 206 having a high thermal conductivity, for example, copper or copper alloy and a second metal material 207 having a low thermal expansion coefficient, for example, consisting of alloy of iron- nickel, iron-cabalt-nickel attrached to the side surface thereof. Heat generated by semiconductor element 204 is radiated to a heat radiating base 201 through the metal material 206. Thermal expansion of metal material 206 is suppressed by the metal material 207. Therefore, a stress generated by difference of thermal expansion coefficient between semiconductor element 204 and support 205 can be alleviated.</p> |
