| 摘要 |
PURPOSE:To avoid the building up of jointing solder by varying arbitrarily a pressing load of a semiconductor chip against a subplate. CONSTITUTION:A semiconductor chip 1 is mounted on a prescribed position of a submount 2 and jointed by melting solder on the submount 2 by heating from beneath the submount 2. The pressing of the chip 1 against the submount 2 is straight pressur type and the load is applied by a pressing rod 17 and a weight 18 put on the rod 17. By blowing the compressed air through side holes 24 of a loading head 19, the chip pressing load can be reduced. |
