HIGH DENSITY CIRCUIT FORMATION

摘要

PURPOSE:To obtain a continuous metal film without unevenness by a method wherein resin mixture of synthetic resin such as sulfide resin gold and a solvent is applied all over a substrate and dried and baked to form a metal film and photosensitive emulsion is applied on the metal film and exposed and developed. CONSTITUTION:Synthetic resin such as sulfide resin gold, rhodium resin, bismuth resin, chrome resin, nickel resin and ethylcellose are mixed with a solvent to make printing ink. This ink is applied all over a substrate and dried and baked. Then photosensitive emulsion is applied on the surface and exposed and baked. The solvent and the resin are burnt out during the baking and the remainder metals compose alloy so that a circuit composed of continuous alloy coupling surface is formed on the substrate.